Cover image for Microwave materials and fabrication techniques
Title:
Microwave materials and fabrication techniques
Author:
Laverghetta, Thomas S.
Personal Author:
Edition:
Third edition.
Publication Information:
Boston, MA : Artech House, 2000.
Physical Description:
xii, 287 pages : illustrations ; 24 cm.
Language:
English
ISBN:
9781580530644
Format :
Book

Available:*

Library
Call Number
Material Type
Home Location
Status
Item Holds
Searching...
TK7876 .L378 2000 Adult Non-Fiction Non-Fiction Area
Searching...

On Order

Summary

Summary

Featuring current technology developments, this text examines every aspect of microwave circuit design and fabrication techniques. Topics covered include: circuit board materials, etching, and packaging.


Author Notes

Thomas S. Laverghetta received his BSEE from Syracuse University and his MSEE from Purdue.

Mr. Laverghetta is a professor in the electrical engineering department at Purdue University researching microwave materials and their characteristics. He was previously a senior engineer with ITT Aerospace. He is a member of the American Society of Engineering Education, the American Consultants League, and the Institute for Interconnecting and Packaging Electronic Circuits, and a Senior Member of the IEEE. He is the author of other four Artech House books, including Microwave Measurements and Techniques (1976), Handbook of Microwave Testing (1981), Solid State Microwave Devices (1987) and Microwaves and Wireless Simplified (1997).

050


Table of Contents

Prefacep. ix
Acknowledgmentsp. xi
1 Introductionp. 1
2 Laminates and Substratesp. 9
2.1 Introductionp. 9
2.2 Microwave Material Termsp. 10
2.2.1 Dielectric Constantp. 10
2.2.2 Anisotropyp. 12
2.2.3 Dissipation Factorp. 13
2.2.4 Dielectric Thicknessp. 15
2.2.5 Copper Weightp. 18
2.2.6 Coefficient of Thermal Expansion (CTE)p. 29
2.2.7 Peel Strengthp. 30
2.3 Microwave Material Historyp. 31
2.4 Teflon Fiberglass Materialsp. 34
2.5 Non-Teflon Materialsp. 38
2.6 Thermoset Polymer Compositesp. 39
2.7 Polyester Materialsp. 40
2.8 Alumina Substratesp. 41
2.9 Sapphire, Quartz, and Beryllia Substratesp. 43
2.10 Material Specificationsp. 43
2.11 UL Requirementsp. 46
2.12 Choice of Materialsp. 48
2.13 Chapter Summaryp. 50
3 Metalsp. 51
3.1 Introductionp. 51
3.2 Aluminump. 53
3.3 Copperp. 56
3.4 Silverp. 58
3.5 Goldp. 59
3.6 Miscellaneous Metalsp. 60
3.6.1 Indiump. 62
3.6.2 Tinp. 63
3.6.3 Leadp. 64
3.6.4 Kovar and Invarp. 65
3.7 Metal Applicationsp. 66
3.8 Chapter Summaryp. 67
4 Microwave Artworkp. 69
4.1 Introductionp. 69
4.2 Initial Layoutp. 71
4.3 Final Layoutp. 76
4.4 Chapter Summaryp. 86
5 Etching and Plating Techniquesp. 87
5.1 Introductionp. 87
5.2 Etching Techniquesp. 88
5.2.1 Cleaningp. 88
5.2.2 Photoresistsp. 91
5.2.3 Artwork Placement and Exposurep. 95
5.2.4 Etchingp. 99
5.3 Plating and Plated-Through-Holesp. 106
5.3.1 Platingp. 106
5.3.2 Plated-Through-Holesp. 111
5.4 Alternate Methods of Producing Circuit Boardsp. 112
5.5 Chapter Summaryp. 113
6 Bonding Techniquesp. 115
6.1 Introductionp. 115
6.2 Solderp. 116
6.3 Epoxyp. 126
6.4 Bondsp. 134
6.4.1 Thermocompression Bondingp. 135
6.4.2 Ultrasonic Bondingp. 141
6.4.3 Thermosonic Bondingp. 143
6.5 Component and Substrate Attachmentp. 144
6.6 Chapter Summaryp. 149
7 Microwave Packagingp. 151
7.1 Introductionp. 151
7.2 Microstrip Packagep. 158
7.3 Stripline Packagingp. 167
7.4 Package Sealingp. 173
7.5 Microwave Connectorsp. 174
7.6 EMI Considerationsp. 175
7.7 Chapter Summaryp. 177
Appendix A Dielectric Constantsp. 179
Appendix B Coefficients of Expansionp. 181
Appendix C Chemical Symbolsp. 183
Appendix D Melting Pointsp. 185
Appendix E Temperature Conversionp. 187
Appendix F Data Sheets for Microwave Laminatesp. 191
Appendix G Microwave Connectorsp. 265
Bibliographyp. 271
About the Authorp. 277
Indexp. 279