Microchip fabrication : a practical guide to semiconductor processing

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Title:

Author:

Van Zant, Peter.

Personal Author:

Van Zant, Peter.

Edition:

Fourth edition.

Publication Information:

New York : McGraw-Hill, [2000]

Physical Description:

xvi, 632 pages : illustrations ; 24 cm

Language:

English

Subject Term:

Semiconductors -- Design and construction.

ISBN:

9780071356367

Format :

Book

Available:*

Library	Call Number	Material Type	Home Location	Status	Item Holds
Searching... Central Library	TK7871.85 .V36 2000 4TH. EDITION	Adult Non-Fiction	Non-Fiction Area	Searching... Unknown	Searching... Unavailable

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Preface	p. xv
Chapter 1. The Semiconductor Industry	p. 1
Birth of an Industry	p. 1
The Solid State Era	p. 3
Integrated Circuits (I.C.'s)	p. 4
Process and Product Trends	p. 5
Industry Organization	p. 11
Stages of Manufacturing	p. 13
The Development Decade (1951-1960)	p. 16
The Processing Decade (1961-1970)	p. 18
The Production Decade (1971-1980)	p. 19
The Automation Decade (1981-1990)	p. 20
The Production Era (1991-2000)	p. 20
The Nano Era	p. 22
Key Terms	p. 23
Review Questions	p. 23
References	p. 23
Chapter 2. Semiconductor Materials and Process Chemicals	p. 25
Atomic Structure	p. 26
The Periodic Table of the Elements	p. 27
Electrical Conduction	p. 29
Dielectrics and Capacitors	p. 30
Intrinsic Semiconductors	p. 31
Doped Semiconductors	p. 31
Electron and Hole Conduction	p. 34
Carrier Mobility	p. 36
Semiconductor Production Materials	p. 37
Semiconducting Compounds	p. 37
Silicon Germanium	p. 38
Ferroelectric Materials	p. 38
Process Chemicals	p. 39
States of Matter	p. 41
Plasma State	p. 42
Properties of Matter	p. 42
Pressure and Vacuum	p. 43
Acids, Alkalis, and Solvents	p. 45
The Safety Material Data Sheet	p. 47
Key Terms and Concepts	p. 47
Review Questions	p. 47
References	p. 48
Chapter 3. Manufacturing Wafers	p. 49
Introduction	p. 50
Semiconductor Silicon Preparation	p. 50
Crystalline Materials	p. 51
Crystal Orientation	p. 52
Crystal Growth	p. 53
Crystal and Wafer Quality	p. 57
Wafer Preparation	p. 59
Wafer Slicing	p. 61
Wafer Marking	p. 62
Rough Polish	p. 62
Chemical Mechanical Polishing (CMP)	p. 63
Backside Processing	p. 64
Double-Sided Polishing	p. 64
Edge Grinding and Polishing	p. 64
Wafer Evaluation	p. 65
Oxidation	p. 65
Packaging	p. 65
Epi on Silicon Wafers	p. 66
Key Terms	p. 66
Review Questions	p. 66
References	p. 67
Chapter 4. Overview of Wafer Fabrication	p. 69
Goal of Wafer Fabrication	p. 70
Wafer Terminology	p. 70
Basic Wafer-Fabrication Operations	p. 71
Manufacturing Semiconductor Devices and Circuits	p. 75
Example Fabrication Process	p. 79
Chip Terminology	p. 82
Wafer Sort	p. 82
Packaging	p. 85
Summary	p. 85
Key Concepts and Terms	p. 86
Review Questions	p. 86
References	p. 86
Chapter 5. Contamination Control	p. 87
Introduction	p. 88
The Problem	p. 88
Contamination Sources	p. 92
Clean-Room Construction	p. 101
Clean-Room Materials and Supplies	p. 114
Clean-Room Maintenance	p. 114
Wafer Surface Cleaning	p. 115
Key Concepts and Terms	p. 130
Review Questions	p. 130
References	p. 131
Chapter 6. Process Yields	p. 133
Yield Measurement Points	p. 133
Accumulative Wafer-Fabrication Yield	p. 134
Wafer-Fabrication Yield Limiters	p. 136
Wafer-Sort Yield Factors	p. 141
Assembly and Final Test Yields	p. 149
Overall Process Yields	p. 149
Key Concepts and Terms	p. 151
Review Questions	p. 151
References	p. 152
Chapter 7. Oxidation	p. 153
Silicon Dioxide Layer Uses	p. 154
Thermal Oxidation Mechanisms	p. 157
Thermal Oxidation Methods	p. 163
Horizontal Tube Furnaces	p. 164
Vertical Tube Furnaces	p. 177
Fast Ramp Furnaces	p. 179
Rapid Thermal Processing (RTP)	p. 179
High-Pressure Oxidation	p. 183
Oxidation Processes	p. 185
Postoxidation Evaluation	p. 186
Anodic Oxidation	p. 188
Thermal Nitridation	p. 188
Key Concepts and Terms	p. 189
Review Questions	p. 189
References	p. 190
Chapter 8. Basic Patterning--Surface Preparation to Exposure	p. 193
Introduction	p. 194
Overview of the Photomasking Process	p. 195
Ten-Step Process	p. 197
Basic Photoresist Chemistry	p. 198
Photoresist Performance Factors	p. 203
Comparison of Positive and Negative Resists	p. 207
Physical Properties of Photoresists	p. 209
Photomasking Processes	p. 213
Surface Preparation	p. 213
Photoresist Spinning	p. 217
Soft Bake	p. 222
Alignment and Exposure	p. 227
Aligner System Comparison	p. 239
Key Concepts and Terms	p. 240
Review Questions	p. 240
References	p. 240
Chapter 9. Basic Patterning--Developing to Final Inspection	p. 243
Development	p. 243
Hard Bake	p. 250
Develop Inspect	p. 252
Etch	p. 256
Wet Etching	p. 256
Dry Etch	p. 263
Resist Stripping	p. 270
Final Inspection	p. 274
Mask Making	p. 274
Summary	p. 277
Key Concepts and Terms	p. 278
Review Questions	p. 278
References	p. 279
Chapter 10. Advanced Photolithography Processes	p. 281
Optical Resolution Control	p. 283
Other Exposure Issues	p. 288
Pellicles	p. 292
Surface Problems	p. 294
Antireflective Coatings	p. 295
Planarization	p. 297
Photoresist Process Advances	p. 298
CMP Summary	p. 308
Improving Etch Definition	p. 313
Self-Aligned Structures	p. 314
Etch Profile Control	p. 314
The End of Optical Lithography?	p. 315
Key Concepts and Terms	p. 316
Review Questions	p. 316
References	p. 316
Chapter 11. Doping	p. 319
Definition of a Junction	p. 319
Formation of a Doped Region	p. 320
Formation of a Doped Region and Junction by Diffusion	p. 321
Diffusion Process Steps	p. 326
Deposition	p. 326
Drive-in-Oxidation	p. 335
Introduction to Ion Implantation	p. 337
Concept of Ion Implantation	p. 340
Ion Implantation System	p. 340
Dopant Concentration in Implanted Regions	p. 348
Evaluation of Implanted Layers	p. 352
Uses of Ion Implantation	p. 354
The Future of Doping	p. 355
Key Concepts and Terms	p. 356
Review Questions	p. 356
References	p. 356
Chapter 12. Deposition	p. 359
Introduction	p. 359
Chemical Vapor Deposition Basics	p. 363
CVD Process Steps	p. 366
CVD System Types	p. 366
Atmospheric Pressure CVD Systems	p. 367
Low-Pressure Chemical Vapor Deposition (LPCVD)	p. 371
Plasma-enhanced CVD (PECVD)	p. 373
Vapor Phase Epitaxy (VPE)	p. 376
Molecular Beam Epitaxy (MBE)	p. 377
Metalorganic CVD (MOCVD)	p. 378
Deposited Films	p. 379
Deposited Semiconductors	p. 380
Epitaxial Silicon	p. 380
Polysilicon and Amorphous Silicon Deposition	p. 386
SOS and SOI	p. 388
Insulators and Dielectrics	p. 389
Conductors	p. 392
Key Concepts and Terms	p. 393
Review Questions	p. 393
References	p. 393
Chapter 13. Metallization	p. 395
Introduction	p. 396
Conductors-Single Level Metal	p. 396
Conductors-Multilevel Metal Schemes	p. 397
Conductors	p. 398
Metal Film Uses	p. 405
Deposition Methods	p. 407
Vacuum Pumps	p. 416
Key Concepts and Terms	p. 422
Review Questions	p. 422
References	p. 424
Chapter 14. Process and Device Evaluation	p. 427
Introduction	p. 428
Wafer Electrical Measurements	p. 429
Physical Measurement Methods	p. 434
Layer Thickness Measurements	p. 435
Junction Depth	p. 440
Critical Dimensions (CD) and Line Width Measurements	p. 443
Contamination and Defect Detection	p. 446
General Surface Characterization	p. 453
Contamination Identification	p. 454
Device Electrical Measurements	p. 457
Key Concepts and Terms	p. 466
Review Questions	p. 467
References	p. 467
Chapter 15. The Business of Wafer Fabrication	p. 469
Fabrication and Factory Economics Overview	p. 470
Wafer-Fabrication Costs	p. 471
Equipment	p. 477
Cost of Ownership	p. 479
Automation	p. 480
Factory-Level Automation	p. 483
Equipment Standards	p. 485
Statistical Process Control (SPC)	p. 487
Inventory Control	p. 492
Line Organization	p. 494
Key Concepts and Terms	p. 496
Review Questions	p. 496
References	p. 496
Chapter 16. Semiconductor Devices and Integrated Circuit Formation	p. 499
Semiconductor-Device Formation	p. 499
Integrated-Circuit Formation	p. 518
Superconductors	p. 529
Microelectromechanical systems (MENS)	p. 530
Key Concepts and Terms	p. 536
Review Questions	p. 537
References	p. 537
Chapter 17. Integrated Circuit Types	p. 539
Introduction	p. 539
Circuit Basics	p. 540
Integrated-Circuit Types	p. 542
Wafer Scale Integration	p. 552
The Next Generation	p. 553
Key Concepts and Terms	p. 554
Review Questions	p. 554
References	p. 555
Chapter 18. Packaging	p. 557
Introduction	p. 557
Chip Characteristics	p. 558
Package Functions and Design	p. 560
Overview of Packaging Operations	p. 561
Packaging Processes	p. 567
Package Process Flows	p. 584
Package/Bare Die Strategies	p. 585
Package Design	p. 586
Package Type/technology Summary	p. 591
Key Concepts and Terms	p. 592
Review Questions	p. 592
References	p. 592
Glossary	p. 595
Index	p. 615

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Table of Contents