Cover image for The electronic packaging handbook
Title:
The electronic packaging handbook
Author:
Blackwell, Glenn R.
Publication Information:
Boca Raton, FL : CRC Press : IEEE Press, [2000]

©2000
Physical Description:
1 volume (various pagings) : illustrations ; 26 cm.
Language:
English
Added Author:
ISBN:
9780849385919
Format :
Book

Available:*

Library
Call Number
Material Type
Home Location
Status
Central Library TK7870.15 .E4233 2000 Adult Non-Fiction Non-Fiction Area-Reference
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Summary

Summary

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.

The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.

Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.

Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.


Table of Contents

Fundamentals of the Design Process
Surface Mount Technology
Integrated Circuit Packages
Direct Chip Attach
Circuit Boards
EMC and PCB Design
Hybrid Assemblies
Interconnects
Design for Test
Adhesive and Its Application
Thermal Management
Testing
Inspection
Package/Enclosure
Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach
Product Safety and Third-Party Certification
Appendix A Definitions
Index

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